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    首页 > 集团产业 > 创新产品 > 半导体包装材料
    JEDEC TRAY
    产品详情
    QFP/ LQFP/ TQFP (7X7, 10X10,…,32X32)
    BGA/ TFBGA/ FCBGA /PBGA(3X3, 4X4,…,42.5X42.5)
    TSOP/ SOP/ PLCC
    QFN/ BCC/ LGA (3x3, 4X4,…,11X11)
    MMC/ SD/ mini SD/ Micro SD/ M2
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    Hi Temp Tray （Reflow）180°C~270°C
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